R&D Applications Engineer
Piscataway, NJ, US
Engineering
Bachelors Degree
Full Time, Temp to Hire
Experienced (Non-Manager)
On-site
Electronics/Components and Semiconductor Mfg
First Shift (Day)
Piscataway, NJ, US
Experienced (Non-Manager)
Full Time, Temp to Hire
Electronics/Components and Semiconductor Mfg
On-site
Engineering
Bachelors Degree
First Shift (Day)
Job details
R&D Applications Engineer (Piscataway, NJ)
Applications Engineer, Semiconductor, Additives, Product Development. Our client in Semiconductors is hiring an R&D Applications Engineer, key responsibility is to work with the rest of the R&D team on new product development initiatives of next generation products in the ATROX standard die attach product line. The engineer will be required to prepare the necessary material for conducting electrical and mechanical reliability tests while following up with extensive failure analysis. The Application Engineer will be expected to plan and perform all necessary experiments, analyze, process and report data to peers and learned audiences.
What you will be doing:
Responsible for executing NPD initiatives related to material and application development for next-generation materials and technologies in semiconductor die attach.
Responsible for establishing innovative testing methods and conducting the assembly and testing of semiconductor packages to evaluate MAES-SA’s new products and materials.
Responsible for defining a process for optimized use of the products in an HVM environment with high levels of yield and performance.
Work with R&D chemists and assist in validation of new die attach adhesives and related products.
Collaborating with Global R&D, Application and Marketing teams to set and meet project objectives.
Attending and participating in key customer TRM’s and leading industry technical seminars/symposiums to identify pressing industry issues and possible material solutions, thereby determining key NPD/Innovative material and process solutions.
Writing technical papers and communications for conferences and peer review journals.
Who you’ll need to be:
Basic understanding of materials, chemistry and physical properties.
Hands-on experience with analytical and various dispensing and bonding equipment.
Experienced in operating and maintaining test and inspection equipment, including ESEC Die Bonder, Dage Die Shear, X-Ray machines, microscopes, SEM, wafer laminators, dicing saws, programmable ovens, sinter presses, and molding equipment.
Extensive knowledge of software like MS Office and statistical programs such as Minitab.
Bachelor of Science degree in Chemical Engineering, Mechanical Engineering, Materials Science & Engineering, or a related field.
Three years of relevant experience and/or training. An equivalent combination of education and experience is also acceptable.
What competencies will you need?
Good communication skills.
Ability to work in a team environment with strong collaborative skills.
Record of demonstrating problem solving and critical thinking.
High ethical standards and ability to maintain confidentiality.
Ability to work in a fast-paced and multi-task environment.
Ability to read, analyze, and interpret general business correspondence, technical procedures, and interpret common scientific and technical journals.
Ability to write reports and business correspondences, and effectively present information and respond to questions from top management, groups of managers, clients, customers, and the general public.
We are we Offering…
Challenge Yourself and Impact the Future - We are committed to solving the complete and evolving needs of our customers through innovation and high-quality standards. We are focused on bringing cutting edge and environmentally sustainable solutions to the market. Our people are the critical resource required to make that happen. We support your success by creating a strong, inclusive culture, competitive total rewards and an appropriate work-life balance. You will have …
Opportunities for career growth, competitive compensation (competitive base salary and performance related bonus plan) and benefits packages (health, dental, and vision insurance, Wellness Program, PTO/Holidays, as well as a 401(k)-retirement plan with a company match).
Innovated work environment where you will be a part of a dynamic and collaborative team.
Perks and Incentives such as paid parental leave, tuition reimbursement, and opportunities for professional development.
Additional Information:
Our Expertise:
Wafer Level Solutions: Revolutionizing wafer fabrication processes for enhanced efficiency and performance.
Semiconductor Assembly Solutions: Driving innovation in semiconductor assembly processes for unparalleled reliability.
Circuitry Solutions: Tailored solutions to meet the dynamic demands of modern circuitry.
Circuit Board Assembly Solutions: Elevating circuit board assembly processes for optimal performance.
Film & Smart Surface Solutions: Transforming electronics with cutting-edge materials and technologies for enhanced functionality and reliability.
Market- Across diverse sectors including automotive, consumer electronics, mobile devices, telecom, data storage, and infrastructure. Our comprehensive range of high-quality solutions and technical services covers the entire electronics supply chain, empowering businesses to thrive in today’s competitive landscape.
More about the role-
We are looking for an Applications Engineer to support the commercial expansion of products into the Power Electronics market in the United States, with a primary focus on the USA, by assisting laboratory functions at our Piscataway, New Jersey facility
Day to Day:
Co-manage daily operations of the Piscataway, NJ Laboratory, maintaining a safe, 5S-compliant environment for internal and customer-facing activities.
Operate, maintain, and troubleshoot specialized processing equipment (e.g., P&P machines, reflow ovens, sinter presses, printing systems, environmental chambers, die shear testers, and electrical probing tools).
Lead customer projects from conception to completion, including electronic assembly builds and DOE (Design of Experiments) execution for material and process improvements.
Implement global and local best practices for power electronic assembly, and proactively identify process optimizations.
Capture Voice of Customer feedback and communicate insights to the global team.
Gather, analyze, and report process and analytical data; support technical documentation including reports, papers, and presentations for the sales team.
Collaborate with partner companies (e.g., machine suppliers) and support failure mode analysis, defect identification, and solutions for product improvement.
Assist R&D efforts by conducting performance tests and supporting multi-site, global development projects.
Design, commission, and utilize specialized tools for sample build campaigns.
Work closely with facility coworkers and report to the group manager; travel domestically and internationally as needed to support internal divisions and external customers.
Background:
3 plus years minimum in Electronics Assembly or Semiconductor or similar.
Electronic Adhesive experience for Semiconductor Fab., Die Attach Adhesives or Die Attach Bonding experience or similar.
Knowledge of Computer-Aided Design (CAD) tools and applications.
Travel domestically and internationally as needed.
3-4 years as a Product Development / Application Engineer with experience in electronic adhesives, packaging, preferably in Semiconductor packaging.
Expertise in die attach adhesives, die attach underfill, and mold compounds, as the majority of semiconductor assembly
Work happens in Asia, though their customers are global companies like Intel, Micron, AMD, TI, and Apple.
Will focus on training and familiarization with the Atrox data attached line, including a few weeks of training in Singapore, and then the role will transition to more engineering responsibilities like equipment maintenance, test method development, and data generation.
Initially focus on training and understanding the product portfolio, take on responsibilities like equipment maintenance, test method development, and customer support.
Experienced in operating and maintaining test and inspection equipment, including ESEC Die Bonder, Dage Die Shear, X-Ray machines, microscopes, SEM, wafer laminators, dicing saws, programmable ovens, sinter presses, and molding equipment.
Bachelor of Science degree in Chemical Engineering, Mechanical Engineering, Materials Science Engineering, or a related field.
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