Title: Manufacturing Product Engineer
Location: Lehi, UT (Relocation Package Offered)
Position Type: Direct Hire
Salary: $100K-$155K with full benefits package and competitive full compensation package

SUMMARY
This is a unique chance to join a cutting-edge semiconductor manufacturer during a period of major expansion at their Lehi facility. With the development of LFAB2 and increasing production volumes, we’re seeking skilled Product Engineers who will contribute meaningful innovations in a rapidly growing environment. If you have more than three years of proven experience in the semiconductor field and are passionate about yield improvement and bringing new products to life, consider this opportunity to impact the industry’s future with a collaborative and driven organization. You’ll help tackle the challenges and realize the advancements shaping modern manufacturing

RESPONSIBILITIES

• Yield Optimization: Tackle yield issues by analyzing manufacturing output data, pinpointing issues, and implementing solutions that bolster both product quality and process efficiency
  

• New Product Launch: Partner with business units throughout the introduction of new products, guiding them from initial validation through to full production release and stable manufacturing
  

• Production Support: Support ongoing production by resolving daily obstacles related to yield, quality, and operations
  

• Continuous Improvement: Spearhead projects to boost productivity, reduce production costs, and improve overall process quality
  

• Data-Driven Insights: Leverage statistical analysis and manufacturing data to inform crucial engineering initiatives and enhance processes
  

• Design Collaboration: Interface with design engineers on simulation, verification, and debugging efforts for silicon-based products 
  

• Cross-functional Collaboration: Work across functional teams—including product engineering, test, and hardware groups—to refine test programs and hardware for optimal performance.

MINIMUM REQUIREMENTS

• 3 years of experience in the semiconductor industry as a Product Engineer, Yield Engineer, or similar role
  

• Bachelor’s degree in Computer Engineering, Electrical Engineering, Materials Science Engineering, or related engineering degree

 
PREFERRED QUALIFICATIONS

• Proven skills with manufacturing analytics, yield troubleshooting, and large sets of production data
  

• Hands-on experience using tools such as JMP, Excel, and similar platforms for statistical analysis
  

• Clear, effective communicator who excels when collaborating both individually and in team settings
  

• Knowledge and background in analog/mixed-signal circuit design and validation (e.g., OP Amps, ADCs, DACs, RF circuitry)
  

• Experience in digital logic verification, including ATPG and scan chain methodologies
  

• Understanding of memory systems like SRAM and Flash
  

• Solid understanding of semiconductor processing, from wafer fab through assembly and final test
  

• Strong foundation in device operation and circuit functionality
  

• Demonstrated track record of driving results, meeting deadlines, and managing concurrent priorities in a dynamic setting
  

• Creative and tenacious problem-solver, attentive to details and adept at finding innovative solutions
  

• Able to communicate and break down technical findings for audiences both technical and non-technical
  

• Can strategically approach challenges and respond calmly and professionally under pressure

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